Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12234390 | Debondable compositions | Shengqian Kong, Yayun Liu, Stephen Hynes, John G. Woods, Jiangbo Ouyang +2 more | 2025-02-25 |
| 11840634 | Stretchable electrically conductive ink compositions | Robert P. Cross, Bahram Issari, Lynnette Hurlburt, Jiangbo Ouyang, Rudolf Oldenzijl +1 more | 2023-12-12 |
| 11814530 | Stretchable electrically conductive ink compositions | Robert P. Cross, Zhan Hang Yang, Jiangbo Ouyang, Yu Chen, Lynnette Hurlburt +1 more | 2023-11-14 |
| 11339304 | Polymer emulsion as binder for conductive composition | Qinyan Zhu, John G. Woods, Hong Jiang, Junjun Wu, Mark E. Jason | 2022-05-24 |
| 10392543 | Reactive resins and formulations for low refractive index and low dielectric constant applications | Bahram Issari, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang +1 more | 2019-08-27 |
| 10280349 | 1K UV and thermal cure high temperature debondable adhesive | Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John G. Woods, Bahram Issari +2 more | 2019-05-07 |
| 9850409 | High temperature debondable adhesive | Xiaoyan Huang, Shengqian Kong, Xiao Allison Yue, Stephen Hynes, Jiangbo Ouyang +1 more | 2017-12-26 |