Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10995232 | Flexible conductive ink | Jie Cao, Jose Garcia-Miralles, Rudie Oldenzijl, Gunther Dreezen, Qili Wu +1 more | 2021-05-04 |
| 10999933 | Conductive material and process | Bin Wei, Xiaoyan Huang | 2021-05-04 |
| 10923249 | Electroless plating of silver onto graphite | Jie Cao, Wenhua Huang | 2021-02-16 |
| 10361016 | Electroless plating of silver onto graphite | Jie Cao, Wenhua Huang | 2019-07-23 |
| 8921464 | Adhesive compositions and use thereof | Yayun Liu, Charles W. Paul, Andrea Eodice | 2014-12-30 |
| 8921443 | Radiation curable temporary laminating adhesive for use in high temperature applications | Donald Herr, Shengqian Kong, Sharon Chaplinsky | 2014-12-30 |
| 8586650 | Thermally conductive composition | Yimin Zhang | 2013-11-19 |
| 8426986 | Phase separated curable compositions | Yayun Liu | 2013-04-23 |
| 7722786 | Conductive materials | Lirong Bao, Bin Wei | 2010-05-25 |
| 7608487 | B-stageable underfill encapsulant and method for its application | Quinn K. Tong, Bodan Ma, Gyanendra Dutt | 2009-10-27 |