Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7608487 | B-stageable underfill encapsulant and method for its application | Allison Yue Xiao, Quinn K. Tong, Gyanendra Dutt | 2009-10-27 |
| 7037399 | Underfill encapsulant for wafer packaging and method for its application | Quinn K. Tong, Yue Xiao, Sun Hee Hong | 2006-05-02 |
| 6833629 | Dual cure B-stageable underfill for wafer level | Sun Hee Hong, Quinn K. Tong | 2004-12-21 |
| 6350838 | Package encapsulant compositions for use in electronic devices | Quinn K. Tong | 2002-02-26 |
| 6316566 | Package encapsulant compositions for use in electronic devices | Quinn K. Tong | 2001-11-13 |
| 6281314 | Compositions for use in the fabrication of circuit components and printed wire boards | Quinn K. Tong, Chaodong Xiao | 2001-08-28 |
| 6180187 | Method of making an electronic component using reworkable underfill encapsulants | Quinn K. Tong, Chaodong Xiao | 2001-01-30 |
| 6063828 | Underfill encapsulant compositions for use in electronic devices | Quinn K. Tong | 2000-05-16 |
| 6057381 | Method of making an electronic component using reworkable underfill encapsulants | Quinn K. Tong, Chaodong Xiao | 2000-05-02 |