Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7037399 | Underfill encapsulant for wafer packaging and method for its application | Quinn K. Tong, Yue Xiao, Bodan Ma | 2006-05-02 |
| 6833629 | Dual cure B-stageable underfill for wafer level | Bodan Ma, Quinn K. Tong | 2004-12-21 |