Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230888 | Wafer back side coating as dicing tape adhesive | Qizhuo Zhuo, Elizabeth Hoang, Stephen A. Ruatta | 2016-01-05 |
| 7608487 | B-stageable underfill encapsulant and method for its application | Allison Yue Xiao, Quinn K. Tong, Bodan Ma | 2009-10-27 |