Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985108 | Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof | Xuan Hong, Xinpei Cao, Derek Wyatt, Qizhuo Zhuo | 2021-04-20 |
| 9230888 | Wafer back side coating as dicing tape adhesive | Gyanendra Dutt, Qizhuo Zhuo, Stephen A. Ruatta | 2016-01-05 |