Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12042883 | Sinterable films and pastes and methods for use thereof | Pukun Zhu, Shashi Gupta, Louis Rector | 2024-07-23 |
| 11745294 | Sinterable films and pastes and methods for use thereof | Pukun Zhu, Shashi Gupta, Louis Rector | 2023-09-05 |
| 11304346 | Method for shielding system-in-package assemblies from electromagnetic interference | Xuan Hong, Daniel Maslyk, Juliet Grace Sanchez | 2022-04-12 |
| 10985108 | Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof | Xuan Hong, Xinpei Cao, Derek Wyatt, Elizabeth Hoang | 2021-04-20 |
| 10858523 | Achieving electromagnetic interference shielding protection by deposition of highly conductive compositions | Junbo Gao, Xinpei Cao, Glenda Castaneda | 2020-12-08 |
| 10834858 | Method for shielding system-in-package assemblies from electromagnetic interference | Xuan Hong, Daniel Maslyk, Juliet Grace Sanchez | 2020-11-10 |
| 10741503 | Graphene-containing materials for coating and gap filling applications | Xuan Hong, Juliet Grace Sanchez, Xinpei Cao | 2020-08-11 |
| 9230888 | Wafer back side coating as dicing tape adhesive | Gyanendra Dutt, Elizabeth Hoang, Stephen A. Ruatta | 2016-01-05 |
| 8759422 | B-stageable and skip-curable wafer back side coating adhesives | Eric Wang, Kevin Becker | 2014-06-24 |
| 7422707 | Highly conductive composition for wafer coating | — | 2008-09-09 |
| 6162849 | Thermally conductive thermoplastic | Ronald M. Harris, Dennis C. Skovran, Leo F. Lightner, Michael S. Randall, Vernon E. Stygar | 2000-12-19 |