Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8759422 | B-stageable and skip-curable wafer back side coating adhesives | Eric Wang, Qizhuo Zhuo | 2014-06-24 |
| 8546485 | Photocurable dicing die bonding tape | Byoungchul Lee, Pauline Chiang | 2013-10-01 |
| 6066710 | Imide-containing polymers made by bulk polymerization | Jerold C. Rosenfeld | 2000-05-23 |