Issued Patents All Time
Showing 126–150 of 520 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8701273 | Method of manufacturing magnetic head for perpendicular magnetic recording having a return path section | Hiroyuki Ito, Hironori Araki, Seiichiro Tomita, Kazuki Sato, Shigeki Tanemura +1 more | 2014-04-22 |
| 8691102 | Method of manufacturing plasmon generator | Hironori Araki, Hiroyuki Ito, Yukinori Ikegawa, Seiichiro Tomita, Shigeki Tanemura | 2014-04-08 |
| 8687320 | Magnetic head for perpendicular magnetic recording having a pole layer including a plurality of stacked magnetic films | Hiroyuki Itoh, Shigeki Tanemura, Hironori Araki, Kazuo Ishizaki, Takehiro Horinaka | 2014-04-01 |
| 8659166 | Memory device, laminated semiconductor substrate and method of manufacturing the same | Hiroyuki Ito, Atsushi Iijima | 2014-02-25 |
| 8653639 | Layered chip package and method of manufacturing same | Hiroyuki Ito, Hiroshi Ikejima, Atsushi Iijima | 2014-02-18 |
| 8652877 | Method of manufacturing layered chip package | Hiroyuki Ito, Hiroshi Ikejima, Atsushi Iijima | 2014-02-18 |
| 8625234 | Graded bevel tapered write pole design for field enhancement | Lijie Guan, Po-Kang Wang, Moris Dovek, Joe Smyth, Kenichi Takano | 2014-01-07 |
| 8618646 | Layered chip package and method of manufacturing same | Hiroyuki Ito, Hiroshi Ikejima, Atsushi Iijima | 2013-12-31 |
| 8619517 | Thermally-assisted magnetic recording head having a plasmon generator | Hiroyuki Ito, Shigeki Tanemura, Kazuki Sato, Hironori Araki | 2013-12-31 |
| 8619518 | Thermally-assisted magnetic recording head having expanded near-field light generating layer and method of manufacture | Hiroyuki Ito, Hironori Araki, Shigeki Tanemura, Kazuki Sato, Ryuji Fujii | 2013-12-31 |
| 8614932 | Thermally-assisted magnetic recording head having a plasmon generator | Hiroyuki Ito, Shigeki Tanemura, Kazuki Sato, Hironori Araki | 2013-12-24 |
| 8593762 | Magnetic head for perpendicular magnetic recording capable of producing a write magnetic field of sufficient magnitude from the main pole while reducing the length of a magnetic path that connects the write shield and the main pole | Hiroyuki Ito, Kazuki Sato, Shigeki Tanemura, Hironori Araki, Tatsuya Shimizu | 2013-11-26 |
| 8587125 | Method of manufacturing layered chip package | Hiroyuki Ito, Atsushi Iijima | 2013-11-19 |
| 8587899 | Magnetic head for perpendicular magnetic recording having a bottom shield including a base part and a protruding part | Hiroyuki Ito, Kazuki Sato, Hironori Araki, Shigeki Tanemura, Tatsuya Shimizu | 2013-11-19 |
| 8576514 | Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive | Hiroyuki Ito, Shigeki Tanemura, Kazuki Sato, Atsushi Iijima | 2013-11-05 |
| 8576674 | Plasmon generator including two portions made of different metals | Hiroyuki Ito, Shigeki Tanemura, Hironori Araki, Kazuki Sato, Yukinori Ikegawa | 2013-11-05 |
| 8569878 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same | Hiroyuki Ito, Atsushi Iijima | 2013-10-29 |
| 8559710 | Color processing apparatus and method thereof for color conversion using ambient light parameter | — | 2013-10-15 |
| 8552534 | Laminated semiconductor substrate, semiconductor substrate, laminated chip package and method of manufacturing the same | Hiroyuki Ito, Shigeki Tanemura, Kazuki Sato, Atsushi Iijima | 2013-10-08 |
| 8541887 | Layered chip package and method of manufacturing same | Hiroyuki Ito, Hiroshi Ikejima, Atsushi Iijima | 2013-09-24 |
| 8536712 | Memory device and method of manufacturing the same | Hiroyuki Ito, Atsushi Iijima | 2013-09-17 |
| 8525167 | Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package | Hiroyuki Ito, Atsushi Iijima | 2013-09-03 |
| 8514520 | Perpendicular magnetic recording head including a front shield part and the method of manufacturing the same | Hiroyuki Ito, Shigeki Tanemura, Kazuki Sato, Atsushi Iijima | 2013-08-20 |
| 8514516 | Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive | Hiroyuki Ito, Hironori Araki, Shigeki Tanemura, Kazuki Sato, Atsushi Iijima | 2013-08-20 |
| 8513034 | Method of manufacturing layered chip package | Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Satoru Sueki, Hiroshi Ikejima | 2013-08-20 |