Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293864 | Coil component and manufacturing method therefor | Kazuhiko Ito, Munehiro Takaku, Junichiro URABE | 2025-05-06 |
| 12170163 | Coil component and manufacturing method therefor | Kazuhiko Ito, Munehiro Takaku, Junichiro URABE | 2024-12-17 |
| 11508494 | Dielectric composition and electronic component | Shota Suzuki | 2022-11-22 |
| 11380482 | Dielectric composition and electronic component | Shota Suzuki, Daisuke Hirose, Shirou Ootsuki, Wakiko SATO | 2022-07-05 |
| 8513034 | Method of manufacturing layered chip package | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki, Hiroshi Ikejima | 2013-08-20 |
| 8324741 | Layered chip package with wiring on the side surfaces | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki, Hiroshi Ikejima | 2012-12-04 |
| 8154116 | Layered chip package with heat sink | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki, Hiroshi Ikejima | 2012-04-10 |
| 8134229 | Layered chip package | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki | 2012-03-13 |
| 8050045 | Electronic component and method of manufacturing the same | Makoto Yoshida | 2011-11-01 |
| 7968374 | Layered chip package with wiring on the side surfaces | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki, Hiroshi Ikejima | 2011-06-28 |
| 7964976 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki, Hiroshi Ikejima | 2011-06-21 |
| 7905008 | Method of manufacturing a coil component | Makoto Yoshida, Tomokazu Ito, Takashi Kudo, Makoto Otomo, Akira Sato | 2011-03-15 |
| 7868442 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki | 2011-01-11 |
| 7863095 | Method of manufacturing layered chip package | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki | 2011-01-04 |
| 7846772 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki | 2010-12-07 |
| 7767494 | Method of manufacturing layered chip package | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki | 2010-08-03 |
| 7745259 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki | 2010-06-29 |
| 7683269 | Thin film device and method for manufacturing the same | Toshiyuki Yoshizawa, Masaomi Ishikura, Masahiro Miyazaki, Akira Furuya | 2010-03-23 |
| 7557439 | Layered chip package that implements memory device | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Satoru Sueki, Ryuji Hashimoto | 2009-07-07 |
| 7414508 | Common mode choke coil and method of manufacturing the same | Makoto Yoshida | 2008-08-19 |
| 7397334 | Coil component and method of manufacturing the same | Makoto Yoshida, Tomokazu Ito, Yukari Hishimura, Yoshikazu Sato | 2008-07-08 |
| 7318269 | Method of manufacturing coil component | Makoto Yoshida | 2008-01-15 |
| 7283028 | Coil component | Makoto Yoshida, Tomokazu Ito, Tadashige Konno | 2007-10-16 |
| 7221250 | Coil component and method of manufacturing the same | Makoto Yoshida, Tomokazu Ito, Yukari Hishimura, Yoshikazu Sato | 2007-05-22 |
| 7145427 | Coil component and method of manufacturing the same | Makoto Yoshida, Tomokazu Ito, Takashi Kudo, Makoto Otomo, Akira Sato | 2006-12-05 |