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Method of manufacturing layered chip package |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Hiroshi Ikejima |
2013-08-20 |
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Layered chip package with wiring on the side surfaces |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Hiroshi Ikejima |
2012-12-04 |
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Layered chip package with heat sink |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Hiroshi Ikejima |
2012-04-10 |
| 8134229 |
Layered chip package |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa |
2012-03-13 |
| 7968374 |
Layered chip package with wiring on the side surfaces |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Hiroshi Ikejima |
2011-06-28 |
| 7964976 |
Layered chip package and method of manufacturing same |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Hiroshi Ikejima |
2011-06-21 |
| 7868442 |
Layered chip package and method of manufacturing same |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa |
2011-01-11 |
| 7863095 |
Method of manufacturing layered chip package |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa |
2011-01-04 |
| 7846772 |
Layered chip package and method of manufacturing same |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa |
2010-12-07 |
| 7767494 |
Method of manufacturing layered chip package |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa |
2010-08-03 |
| 7745259 |
Layered chip package and method of manufacturing same |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa |
2010-06-29 |
| 7557439 |
Layered chip package that implements memory device |
Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Ryuji Hashimoto |
2009-07-07 |
