Issued Patents All Time
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8283595 | Laser processing method and laser processing apparatus | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2012-10-09 |
| 8268704 | Method for dicing substrate | Yoshimaro Fujii, Kenshi Fukumitsu, Naoki Uchiyama | 2012-09-18 |
| 8263479 | Method for cutting semiconductor substrate | Kenshi Fukumitsu, Naoki Uchiyama, Ryuji Sugiura | 2012-09-11 |
| 8247734 | Laser beam machining method | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2012-08-21 |
| 8227724 | Laser processing method and laser processing apparatus | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2012-07-24 |
| 8183131 | Method of cutting an object to be processed | Kenshi Fukumitsu | 2012-05-22 |
| 8058103 | Semiconductor substrate cutting method | Kenshi Fukumitsu, Naoki Uchiyama, Ryuji Sugiura, Kazuhiro Atsumi | 2011-11-15 |
| 7825350 | Laser processing method and laser processing apparatus | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2010-11-02 |
| 7749867 | Method of cutting processed object | Kenshi Fukumitsu | 2010-07-06 |
| 7732730 | Laser processing method and laser processing apparatus | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2010-06-08 |
| 7626137 | Laser cutting by forming a modified region within an object and generating fractures | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-12-01 |
| 7615721 | Laser processing method and laser processing apparatus | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-11-10 |
| 7592238 | Laser processing method and laser processing apparatus | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-09-22 |
| 7566635 | Substrate dividing method | Yoshimaro Fujii, Kenshi Fukumitsu, Naoki Uchiyama | 2009-07-28 |
| 7547613 | Laser processing method and laser processing apparatus | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-06-16 |
| 7489454 | Laser processing device | Kenshi Fukumitsu, Tetsuya Osajima | 2009-02-10 |
| 7396742 | Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2008-07-08 |
| 6992026 | Laser processing method and laser processing apparatus | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2006-01-31 |