Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334339 | Manufacturing method of semiconductor device | SHOSUKE NAKABAYASHI, Masatake Nagaya, Chiaki Sasaoka, Shoichi Onda, Jun Kojima +4 more | 2025-06-17 |
| 11817319 | Laminated element manufacturing method | Takeshi Sakamoto, Yuta Kondoh, Naoki Uchiyama | 2023-11-14 |
| 11211250 | Laminated element manufacturing method | Takeshi Sakamoto, Yuta Kondoh, Naoki Uchiyama | 2021-12-28 |
| 11158601 | Laminated element manufacturing method | Takeshi Sakamoto, Yuta Kondoh, Naoki Uchiyama | 2021-10-26 |
| 11069672 | Laminated element manufacturing method | Takeshi Sakamoto, Yuta Kondoh, Naoki Uchiyama | 2021-07-20 |
| 9409256 | Laser processing method | — | 2016-08-09 |
| 9076855 | Laser machining method | — | 2015-07-07 |
| 9035216 | Method and device for controlling interior fractures by controlling the laser pulse width | — | 2015-05-19 |
| 8865566 | Method of cutting semiconductor substrate | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2014-10-21 |
| 8551817 | Semiconductor substrate cutting method | Kenshi Fukumitsu, Fumitsugu Fukuyo, Naoki Uchiyama, Kazuhiro Atsumi | 2013-10-08 |
| 8513567 | Laser processing method for forming a modified region for cutting in an object | Tetsuya Osajima, Kazuhiro Atsumi | 2013-08-20 |
| 8450187 | Method of cutting semiconductor substrate | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2013-05-28 |
| 8409968 | Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2013-04-02 |
| 8338271 | Laser processing method and chip | Takeshi Sakamoto | 2012-12-25 |
| 8263479 | Method for cutting semiconductor substrate | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2012-09-11 |
| 8143141 | Laser beam machining method and semiconductor chip | Takeshi Sakamoto | 2012-03-27 |
| 8058103 | Semiconductor substrate cutting method | Kenshi Fukumitsu, Fumitsugu Fukuyo, Naoki Uchiyama, Kazuhiro Atsumi | 2011-11-15 |
| 8043941 | Laser processing method and chip | Takeshi Sakamoto | 2011-10-25 |
| 7939430 | Laser processing method | Takeshi Sakamoto | 2011-05-10 |
| 7902636 | Semiconductor chip including a substrate and multilayer part | Takeshi Sakamoto | 2011-03-08 |
| 7897487 | Laser processing method and chip | Takeshi Sakamoto | 2011-03-01 |