Issued Patents All Time
Showing 1–25 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424162 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2022-08-23 |
| 11241757 | Laser processing method and device | Kazuhiro Atsumi, Koji Kuno, Masayoshi Kusunoki, Tatsuya Suzuki, Fumitsugu Fukuyo | 2022-02-08 |
| 10796959 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda | 2020-10-06 |
| 10622255 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2020-04-14 |
| 10556293 | Laser machining device and laser machining method | — | 2020-02-11 |
| 10495804 | Optical plate, light irradiation device, light measurement device, light irradiation method, and light measurement method | Satoshi Yamamoto | 2019-12-03 |
| 10429720 | Wavelength conversion-type spatial light modulation device | Hiroshi Saito, Masatoshi Fujimoto, Shingo Oishi | 2019-10-01 |
| 10293433 | Laser processing method and device | Kazuhiro Atsumi, Koji Kuno, Masayoshi Kusunoki, Tatsuya Suzuki, Fumitsugu Fukuyo | 2019-05-21 |
| 10180525 | Optical plate, light irradiation device, light measurement device, light irradiation method, and light measurement method | Satoshi Yamamoto | 2019-01-15 |
| 10068801 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2018-09-04 |
| 10032622 | Light source device | Akinori Asai | 2018-07-24 |
| 9837315 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda | 2017-12-05 |
| 9824879 | Light source device | Akinori Asai | 2017-11-21 |
| 9711405 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2017-07-18 |
| 9646816 | Light source device | Akinori Asai | 2017-05-09 |
| 9553023 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2017-01-24 |
| 9548246 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2017-01-17 |
| 9543256 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2017-01-10 |
| 9543207 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2017-01-10 |
| 9511449 | Laser processing method and device | Kazuhiro Atsumi, Koji Kuno, Masayoshi Kusunoki, Tatsuya Suzuki, Fumitsugu Fukuyo | 2016-12-06 |
| 9287177 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2016-03-15 |
| 9142458 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2015-09-22 |
| 8969752 | Laser processing method | Fumitsugu Fukuyo, Naoki Uchiyama | 2015-03-03 |
| 8969761 | Method of cutting a wafer-like object and semiconductor chip | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda | 2015-03-03 |
| 8946589 | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda | 2015-02-03 |