Issued Patents All Time
Showing 51–75 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8409968 | Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion | Fumitsugu Fukuyo, Naoki Uchiyama, Ryuji Sugiura | 2013-04-02 |
| 8361883 | Laser processing method | Fumitsugu Fukuyo | 2013-01-29 |
| 8314013 | Semiconductor chip manufacturing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2012-11-20 |
| 8304325 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2012-11-06 |
| 8283595 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda | 2012-10-09 |
| 8268704 | Method for dicing substrate | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2012-09-18 |
| 8263479 | Method for cutting semiconductor substrate | Fumitsugu Fukuyo, Naoki Uchiyama, Ryuji Sugiura | 2012-09-11 |
| 8247734 | Laser beam machining method | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2012-08-21 |
| 8227724 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda | 2012-07-24 |
| 8183131 | Method of cutting an object to be processed | Fumitsugu Fukuyo | 2012-05-22 |
| 8110422 | Manufacturing method of semiconductor laser element | Masayoshi Kumagai, Koji Kuno | 2012-02-07 |
| 8058103 | Semiconductor substrate cutting method | Fumitsugu Fukuyo, Naoki Uchiyama, Ryuji Sugiura, Kazuhiro Atsumi | 2011-11-15 |
| 7947574 | Laser processing method and semiconductor chip | Takeshi Sakamoto | 2011-05-24 |
| 7825350 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda | 2010-11-02 |
| 7749867 | Method of cutting processed object | Fumitsugu Fukuyo | 2010-07-06 |
| 7732730 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda | 2010-06-08 |
| 7718510 | Laser processing method and semiconductor chip | Takeshi Sakamoto | 2010-05-18 |
| 7626137 | Laser cutting by forming a modified region within an object and generating fractures | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-12-01 |
| 7615721 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-11-10 |
| 7605344 | Laser beam machining method, laser beam machining apparatus, and laser beam machining product | — | 2009-10-20 |
| 7592238 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-09-22 |
| 7566635 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Naoki Uchiyama | 2009-07-28 |
| 7547613 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-06-16 |
| 7489454 | Laser processing device | Fumitsugu Fukuyo, Tetsuya Osajima | 2009-02-10 |
| 7396742 | Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object | Fumitsugu Fukuyo, Naoki Uchiyama, Toshimitsu Wakuda | 2008-07-08 |