Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796959 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2020-10-06 |
| 10322469 | Fusion bonding process for glass | Satoshi Matsumoto | 2019-06-18 |
| 9837315 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2017-12-05 |
| 9181126 | Glass fusion method | Satoshi Matsumoto | 2015-11-10 |
| 8969761 | Method of cutting a wafer-like object and semiconductor chip | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2015-03-03 |
| 8946589 | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2015-02-03 |
| 8946591 | Method of manufacturing a semiconductor device formed using a substrate cutting method | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2015-02-03 |
| 8946592 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2015-02-03 |
| 8937264 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2015-01-20 |
| 8933369 | Method of cutting a substrate and method of manufacturing a semiconductor device | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2015-01-13 |
| 8927900 | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2015-01-06 |
| 8716110 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2014-05-06 |
| 8685838 | Laser beam machining method | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Kazuhiro Atsumi, Kenichi Muramatsu | 2014-04-01 |
| 8516852 | Glass fusion method | Satoshi Matsumoto | 2013-08-27 |
| 8283595 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2012-10-09 |
| 8247734 | Laser beam machining method | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Kazuhiro Atsumi, Kenichi Muramatsu | 2012-08-21 |
| 8227724 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2012-07-24 |
| 7825350 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2010-11-02 |
| 7732730 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2010-06-08 |
| 7626137 | Laser cutting by forming a modified region within an object and generating fractures | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-12-01 |
| 7626746 | Shutter unit and laser processing device using same | Norio Kurita, Tetsuya Osajima, Masayoshi Kusunoki, Tatsuya Suzuki | 2009-12-01 |
| 7615721 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-11-10 |
| 7592238 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-09-22 |
| 7547613 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Kazuhiro Atsumi, Kenichi Muramatsu | 2009-06-16 |
| 7396742 | Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object | Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama | 2008-07-08 |