Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8946591 | Method of manufacturing a semiconductor device formed using a substrate cutting method | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2015-02-03 |
| 8946592 | Laser processing method and laser processing apparatus | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2015-02-03 |
| 8937264 | Laser processing method and laser processing apparatus | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2015-01-20 |
| 8933369 | Method of cutting a substrate and method of manufacturing a semiconductor device | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2015-01-13 |
| 8927900 | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2015-01-06 |
| 8895947 | Ultraviolet light generating target, electron-beam-excited ultraviolet light source, and method for producing ultraviolet light generating target | Yoshinori Honda, Takashi Suzuki, Norio Ichikawa, Takeaki Hattori, Koji Kawai +1 more | 2014-11-25 |
| 8890027 | Laser processing method and laser processing system | Etsuji Ohmura, Kenshi Fukumitsu, Masayoshi Kumagai, Kazuhiro Atsumi, Naoki Uchiyama | 2014-11-18 |
| 8889525 | Substrate dividing method | Yoshimaro Fujii, Kenshi Fukumitsu, Naoki Uchiyama | 2014-11-18 |
| 8865566 | Method of cutting semiconductor substrate | Kenshi Fukumitsu, Naoki Uchiyama, Ryuji Sugiura | 2014-10-21 |
| 8802543 | Laser processing method | Kenshi Fukumitsu | 2014-08-12 |
| 8716110 | Laser processing method and laser processing apparatus | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda | 2014-05-06 |
| 8685838 | Laser beam machining method | Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2014-04-01 |
| 8673745 | Method of cutting object to be processed | Kenshi Fukumitsu | 2014-03-18 |
| 8624153 | Laser processing method and device | Kazuhiro Atsumi, Koji Kuno, Masayoshi Kusunoki, Tatsuya Suzuki, Kenshi Fukumitsu | 2014-01-07 |
| 8598015 | Laser processing method | Kenshi Fukumitsu | 2013-12-03 |
| 8551817 | Semiconductor substrate cutting method | Kenshi Fukumitsu, Naoki Uchiyama, Ryuji Sugiura, Kazuhiro Atsumi | 2013-10-08 |
| 8551865 | Method of cutting an object to be processed | Kenshi Fukumitsu | 2013-10-08 |
| 8518801 | Substrate dividing method | Yoshimaro Fujii, Kenshi Fukumitsu, Naoki Uchiyama | 2013-08-27 |
| 8518800 | Substrate dividing method | Yoshimaro Fujii, Kenshi Fukumitsu, Naoki Uchiyama | 2013-08-27 |
| 8519511 | Substrate dividing method | Yoshimaro Fujii, Kenshi Fukumitsu, Naoki Uchiyama | 2013-08-27 |
| 8450187 | Method of cutting semiconductor substrate | Kenshi Fukumitsu, Naoki Uchiyama, Ryuji Sugiura | 2013-05-28 |
| 8409968 | Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion | Kenshi Fukumitsu, Naoki Uchiyama, Ryuji Sugiura | 2013-04-02 |
| 8361883 | Laser processing method | Kenshi Fukumitsu | 2013-01-29 |
| 8314013 | Semiconductor chip manufacturing method | Yoshimaro Fujii, Kenshi Fukumitsu, Naoki Uchiyama | 2012-11-20 |
| 8304325 | Substrate dividing method | Yoshimaro Fujii, Kenshi Fukumitsu, Naoki Uchiyama | 2012-11-06 |