Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424509 | Compliant pad spacer for three-dimensional integrated circuit package | Emad Samadiani, Padam Jain, Yingshi Tang, Sue Yun Teng, Nicholas Chao Wei Wong +1 more | 2025-09-23 |
| 11955406 | Temperature control element utilized in device die packages | Yingying Wang, Emad Samadiani, Madhusudan K. Iyengar, Padam Jain, Xiaojin Wei +2 more | 2024-04-09 |