Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8941116 | Semiconductor device and method of manufacturing the same | — | 2015-01-27 |
| 8941093 | Compound semiconductor device and manufacturing method thereof | — | 2015-01-27 |
| 8872232 | Compound semiconductor device and method for manufacturing the same | — | 2014-10-28 |
| 8765554 | Compound semiconductor device and method for manufacturing the same | Toshihide Kikkawa | 2014-07-01 |
| 8735942 | Compound semiconductor device and manufacturing method of the same | Atsushi Yamada | 2014-05-27 |
| 8728867 | Semiconductor device, manufacturing method of semiconductor device, and power source device | Kozo Shimizu, Keishiro Okamoto, Nobuhiro Imaizumi, Keiji Watanabe | 2014-05-20 |
| 8716748 | Semiconductor device and method of manufacturing the same, and power supply apparatus | Kazukiyo Joshin | 2014-05-06 |
| 8716209 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | Yasushi Kobayashi, Kouta Yoshikawa, Yoshihiro Nakata, Shirou Ozaki | 2014-05-06 |
| 8618577 | Compound semiconductor device and manufacturing method thereof | — | 2013-12-31 |
| 8492784 | Semiconductor device and method for producing the same, and power supply | Keishiro Okamoto, Nobuhiro Imaizumi, Keiji Watanabe | 2013-07-23 |
| 8449787 | Method for wet etching while forming interconnect trench in insulating film | Yoshihiro Nakata, Koji Nozaki | 2013-05-28 |
| 8431464 | Process for producing silicic coating, silicic coating and semiconductor device | Yasushi Kobayashi, Kouta Yoshikawa, Yoshihiro Nakata, Shirou Ozaki | 2013-04-30 |
| 8404584 | Method of manufacturing semiconductor device | Kouta Yoshikawa | 2013-03-26 |
| 8390099 | Interconnection substrate having first and second insulating films with an adhesion enhancing layer therebetween | Shirou Ozaki, Yoshihiro Nakata, Yasushi Kobayashi | 2013-03-05 |
| 8198653 | Compound semiconductor device and manufacturing method of the same | Atsushi Yamada | 2012-06-12 |
| 8164166 | Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device | Yoshihiro Nakata, Kouta Yoshikawa | 2012-04-24 |
| 8089138 | Surface-hydrophobicized film, material for formation of surface-hydrophobicized film, wiring layer, semiconductor device and process for producing semiconductor device | Yoshihiro Nakata | 2012-01-03 |
| 7928536 | Roughness reducing film at interface, materials for forming roughness reducing film at interface, wiring layer and semiconductor device using the same, and method for manufacturing semiconductor device | Yoshihiro Nakata, Ei Yano | 2011-04-19 |
| 7830013 | Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof | Junichi Kon, Ei Yano, Yoshihiro Nakata | 2010-11-09 |
| 7470975 | Composition for forming insulation film, insulation film for semiconductor device, and fabrication method and semiconductor device thereof | Yoshihiro Nakata, Yasushi Kobayashi | 2008-12-30 |