ZW

Zhijie Wang

FS Freeescale Semiconductor: 18 patents #125 of 3,767Top 4%
AL Accenture Global Solutions Limited: 11 patents #63 of 3,138Top 3%
QU Qualcomm: 10 patents #2,039 of 12,104Top 20%
XC Xiamen Tianma Micro-Electronics Co.: 9 patents #36 of 360Top 10%
NU Nxp Usa: 8 patents #192 of 2,066Top 10%
KI Kulicke And Soffa Industries: 5 patents #21 of 219Top 10%
SC Shenzhen Bestwo E-Commerce Co.: 4 patents #1 of 4Top 25%
TC Tianma Microelectronics Co.: 2 patents #166 of 431Top 40%
AC Apollo Intelligent Driving Technology (Beijing) Co.: 2 patents #57 of 222Top 30%
CD Convergent Dental: 2 patents #11 of 14Top 80%
NB Nxp B.V.: 2 patents #1,098 of 3,591Top 35%
GE: 1 patents #19,878 of 36,430Top 55%
Huawei: 1 patents #8,196 of 15,535Top 55%
BC Baidu Online Network Technology (Beijing) Co.: 1 patents #564 of 1,477Top 40%
Overall (All Time): #19,507 of 4,157,543Top 1%
86
Patents All Time

Issued Patents All Time

Showing 76–86 of 86 patents

Patent #TitleCo-InventorsDate
9214447 Non-leaded type semiconductor package and method of assembling same Zhigang Bai, Jinzhong Yao 2015-12-15
9190343 Semiconductor device with tube based heat spreader You Ge, Meng Kong Lye 2015-11-17
8642395 Method of making chip-on-lead package Zhe Li, Qingchun He, Guanhua Wang, Nan Xu 2014-02-04
8536684 Method of assembling shielded integrated circuit device Wei-Min Chen, Zhigang Bai 2013-09-17
8198737 Method of forming wire bonds in semiconductor devices Changliang Zhang, Yingwei Jiang, Wei Xiao 2012-06-12
8100317 Method of teaching eyepoints for wire bonding and related semiconductor processing operations Michael T. Deley, Peter M. Lister, Deepak Sood 2012-01-24
7931186 Method of teaching eyepoints for wire bonding and related semiconductor processing operations Michael T. Deley, Peter M. Lister, Deepak Sood 2011-04-26
7888186 Method for assembling stackable semiconductor packages Zhigang Bai, Weimin Chen 2011-02-15
7887928 Coated lead frame Chao Wang, Qing He, Zhe Li, Dehong Ye 2011-02-15
7613372 Low coupling loss photodetector/optical fiber apparatus and method for forming the same Xin Luo, Pei Chuang Chen, Leming Wang 2009-11-03
7523848 Method and apparatus for measuring the size of free air balls on a wire bonder David T. Beatson, Deepak Sood, Norman Lucas 2009-04-28