MM

Marc Alan Mangrum

FS Freeescale Semiconductor: 18 patents #125 of 3,767Top 4%
AT Amkor Technology: 12 patents #53 of 595Top 9%
AP Amkor Technology Singapore Holding Pte.: 5 patents #63 of 289Top 25%
📍 Manchaca, TX: #1 of 30 inventorsTop 4%
🗺 Texas: #3,051 of 125,132 inventorsTop 3%
Overall (All Time): #97,517 of 4,157,543Top 3%
35
Patents All Time

Issued Patents All Time

Showing 26–35 of 35 patents

Patent #TitleCo-InventorsDate
7696016 Method of packaging a device having a tangible element and device thereof Kenneth R. Burch 2010-04-13
7655502 Method of packaging a semiconductor device and a prefabricated connector Kenneth R. Burch 2010-02-02
7651889 Electromagnetic shield formation for integrated circuit die package Jinbang Tang, Darrel R. Frear, Jong-Kai Lin, Robert E. Booth, Lawrence N. Herr +1 more 2010-01-26
7588951 Method of packaging a semiconductor device and a prefabricated connector Kenneth R. Burch 2009-09-15
7476563 Method of packaging a device using a dielectric layer Kenneth R. Burch 2009-01-13
7361987 Circuit device with at least partial packaging and method for forming George R. Leal, Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer +1 more 2008-04-22
7196427 Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element 2007-03-27
7098073 Method for stacking an integrated circuit on another integrated circuit 2006-08-29
6921975 Circuit device with at least partial packaging, exposed active surface and a voltage reference plane George R. Leal, Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer +1 more 2005-07-26
6838776 Circuit device with at least partial packaging and method for forming George R. Leal, Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer +1 more 2005-01-04