MH

Michael W. Huebner

FO Formfactor: 3 patents #53 of 177Top 30%
AM AMD: 1 patents #5,683 of 9,279Top 65%
EG Endress+Hauser Gmbh+Co.Kg: 1 patents #146 of 306Top 50%
Overall (All Time): #1,019,254 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8324915 Increasing thermal isolation of a probe card assembly Kevin Yasumura, Timothy Blomgren, Jacob Chang 2012-12-04
8271773 Configurable field device for use in process automation systems Udo Grittke, Armin Wernet, Roland Dieterle, Axel Humpert, Dietmar Frühauf +3 more 2012-09-18
7932743 Sequentially configurable programmable integrated circuit Rodney Stewart, Juan J. Noguera Serra, Robert P. Esser, Jürgen Becker, Oliver Sander +2 more 2011-04-26
7924035 Probe card assembly for electronic device testing with DC test resource sharing 2011-04-12
7893700 Configuration of shared tester channels to avoid electrical connections across die area boundary on a wafer Stefan Zschiegner 2011-02-22