TB

Timothy Blomgren

FO Formfactor: 1 patents #105 of 177Top 60%
KL Kla-Tencor: 1 patents #316 of 626Top 55%
Overall (All Time): #2,099,481 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8324915 Increasing thermal isolation of a probe card assembly Kevin Yasumura, Jacob Chang, Michael W. Huebner 2012-12-04
7292427 Pin lift chuck assembly for warped substrates Steven Murdoch 2007-11-06