Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Pin lift chuck assembly for warped substrates

Pin lift chuck assembly for warped substrates

US Patent 7292427 · Granted Nov 6, 2007

Estimated economic value: $25,877,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method, system and apparatus using forward-secure cryptography for passcode veri2019
Flow cytometer biosafety hood and systems including the same2016
Secure network location awareness2014
Increasing thermal isolation of a probe card assembly2012
Dynamic host configuration protocol2012
Dual cassette load lock2003
Dual cassette load lock2002
Dual cassette load lock2002
Dual cassette load lock1998
Dual cassette load lock1993
Semiconductor wafer transfer in processing systems1992
Method and apparatus for handling semiconductor wafers1991