Issued Patents All Time
Showing 201–225 of 230 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6336269 | Method of fabricating an interconnection element | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2002-01-08 |
| 6330164 | Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device | Igor Y. Khandros, David V. Pedersen, Richard S. Roy, Gaetan L. Mathieu | 2001-12-11 |
| 6268015 | Method of making and using lithographic contact springs | Gaetan L. Mathieu, Gary W. Grube | 2001-07-31 |
| 6255126 | Lithographic contact elements | Gaetan L. Mathieu, Gary W. Grube | 2001-07-03 |
| 6246247 | Probe card assembly and kit, and methods of using same | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2001-06-12 |
| 6232149 | "Sockets for ""springed"" semiconductor devices" | Thomas H. Dozier, II, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen +1 more | 2001-05-15 |
| 6215196 | Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals | Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen | 2001-04-10 |
| 6184053 | Method of making microelectronic spring contact elements | Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen | 2001-02-06 |
| 6150186 | Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive | Jimmy Chen, Thomas H. Dozier, II, Junjye Yeh, Gayle Herman | 2000-11-21 |
| 6110823 | Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2000-08-29 |
| 6050829 | Making discrete power connections to a space transformer of a probe card assembly | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2000-04-18 |
| 6043563 | Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals | Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen | 2000-03-28 |
| 6033935 | "Sockets for ""springed"" semiconductor devices" | Thomas H. Dozier, II, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen +1 more | 2000-03-07 |
| 6032356 | Wafer-level test and burn-in, and semiconductor process | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2000-03-07 |
| 5998228 | Method of testing semiconductor | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 1999-12-07 |
| 5994152 | Fabricating interconnects and tips using sacrificial substrates | Igor Y. Khandros, Gaetan L. Mathieu | 1999-11-30 |
| 5983493 | Method of temporarily, then permanently, connecting to a semiconductor device | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 1999-11-16 |
| 5974662 | Method of planarizing tips of probe elements of a probe card assembly | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 1999-11-02 |
| 5912046 | Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component | Igor Y. Khandros, Gaetan L. Mathieu | 1999-06-15 |
| 5897326 | Method of exercising semiconductor devices | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 1999-04-27 |
| 5884398 | Mounting spring elements on semiconductor devices | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 1999-03-23 |
| 5878486 | Method of burning-in semiconductor devices | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 1999-03-09 |
| 5864946 | Method of making contact tip structures | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 1999-02-02 |
| 5832601 | Method of making temporary connections between electronic components | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 1998-11-10 |
| 5829128 | Method of mounting resilient contact structures to semiconductor devices | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 1998-11-03 |