Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9070747 | Electroplating using dielectric bridges | Eugene A. Stout, Anthony P. Curtis, Theodore G. Tessier, Guy F. Burgess | 2015-06-30 |
| 9018750 | Thin film structure for high density inductors and redistribution in wafer level packaging | Robert Forcier | 2015-04-28 |
| 8980743 | Method for applying a final metal layer for wafer level packaging and associated device | Guy F. Burgess, Shannon D. Buzard, Anthony P. Curtis | 2015-03-17 |
| 7550075 | Removal of contaminants from a fluid | Ronald Thomas Bertram, JR. | 2009-06-23 |