SB

Shannon D. Buzard

FI Flipchip International: 1 patents #12 of 18Top 70%
📍 Chandler, AZ: #2,136 of 3,331 inventorsTop 65%
🗺 Arizona: #18,403 of 32,909 inventorsTop 60%
Overall (All Time): #3,043,192 of 4,157,543Top 75%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8980743 Method for applying a final metal layer for wafer level packaging and associated device Guy F. Burgess, Anthony P. Curtis, Douglas M. Scott 2015-03-17