Issued Patents All Time
Showing 51–74 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8358013 | Leadless multi-chip module structure | Huahung Kao | 2013-01-22 |
| 8355221 | Thermal solution for drive systems such as hard disk drives and digital versatile discs | Chenglin Liu | 2013-01-15 |
| 8319353 | Pre-formed conductive bumps on bonding pads | Albert Wu, Huahung Kao | 2012-11-27 |
| 8294248 | Chip on leads | Chenglin Liu | 2012-10-23 |
| 8258616 | Semiconductor dice having a shielded area created under bond wires connecting pairs of bonding pads | — | 2012-09-04 |
| 8218261 | Thermal solution for drive systems such as hard disk drives and digital versatile discs | Chenglin Liu | 2012-07-10 |
| 8030098 | Pre-formed conductive bumps on bonding pads | Albert Wu, Huahung Kao | 2011-10-04 |
| 8022522 | Semiconductor package | Chenglin Liu | 2011-09-20 |
| 7999395 | Pillar structure on bump pad | Huahung Kao | 2011-08-16 |
| 7969022 | Die-to-die wire-bonding | Chenglin Liu | 2011-06-28 |
| 7957094 | Thermal solution for drive systems such as hard disk drives and digital versatile discs | Chenglin Liu | 2011-06-07 |
| 7911053 | Semiconductor packaging with internal wiring bus | Chenglin Liu, Albert Wu | 2011-03-22 |
| 7883947 | Method of fabricating a device with ESD and I/O protection | Chuan-Cheng Cheng, Choy Hing Li | 2011-02-08 |
| 7808075 | Integrated circuit devices with ESD and I/O protection | Chuan-Cheng Cheng, Choy Hing Li | 2010-10-05 |
| 7764462 | Thermal solution for drive systems such as hard disk drives and digital versatile discs | Chenglin Liu | 2010-07-27 |
| 7700475 | Pillar structure on bump pad | Huanhung Kao | 2010-04-20 |
| 7675157 | Thermal enhanced package | Chenglin Liu | 2010-03-09 |
| 7560309 | Drop-in heat sink and exposed die-back for molded flip die package | Huahung Kao | 2009-07-14 |
| 6982220 | Semiconductor device power distribution system and method | — | 2006-01-03 |
| 6770982 | Semiconductor device power distribution system and method | — | 2004-08-03 |
| 5650667 | Process of forming conductive bumps on the electrodes of semiconductor chips using lapping and the bumps thereby created | — | 1997-07-22 |
| 5581119 | IC having heat spreader attached by glob-topping | — | 1996-12-03 |
| 5434105 | Process for attaching a lead frame to a heat sink using a glob-top encapsulation | — | 1995-07-18 |
| 5057907 | Method and structure for forming vertical semiconductor interconnection | Boon K. Ooi, Ka-Heng The, Norman L. Gould | 1991-10-15 |