Issued Patents All Time
Showing 26–50 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9034730 | Recessed semiconductor substrates and associated techniques | Albert Wu, Roawen Chen, Chung Chyung Han, Chien-Chuan Wei, Runzi Chang +2 more | 2015-05-19 |
| 8999755 | Etched hybrid die package | Chenglin Liu | 2015-04-07 |
| 8987830 | Attaching passive components to a semiconductor package | Albert Wu | 2015-03-24 |
| 8940585 | Single layer BGA substrate process | Huahung Kao | 2015-01-27 |
| 8912664 | Leadless multi-chip module structure | Huahung Kao | 2014-12-16 |
| 8900932 | Thermal enhanced package | Chenglin Liu | 2014-12-02 |
| 8884419 | Integrated circuit packaging configurations | Albert Wu | 2014-11-11 |
| 8860193 | Pad configurations for an electronic package assembly | Sehat Sutardja, Huahung Kao | 2014-10-14 |
| 8848313 | Thermal solution for drive systems such as hard disk drives and digital versatile discs | Chenglin Liu | 2014-09-30 |
| 8809118 | Chip on leads | Chenglin Liu | 2014-08-19 |
| 8796868 | Semiconductor layout | Thomas Ngo | 2014-08-05 |
| 8754506 | Through via semiconductor die with backside redistribution layer | Albert Wu | 2014-06-17 |
| 8741694 | Placing heat sink into packaging by strip formation assembly | Chender Chen, Chenglin Liu | 2014-06-03 |
| 8686547 | Stack die structure for stress reduction and facilitation of electromagnetic shielding | Huahung Kao, Thomas Ngo | 2014-04-01 |
| 8673689 | Single layer BGA substrate process | Huahung Kao | 2014-03-18 |
| 8673687 | Etched hybrid die package | Chenglin Liu | 2014-03-18 |
| 8669139 | Leadless multi-chip module structure | Huahung Kao | 2014-03-11 |
| 8637975 | Semiconductor device having lead wires connecting bonding pads formed on opposite sides of a core region forming a shield area | — | 2014-01-28 |
| 8624377 | Method of stacking flip-chip on wire-bonded chip | Albert Wu | 2014-01-07 |
| 8581374 | Placing heat sink into packaging by strip formation assembly | Chender Chen, Chenglin Liu | 2013-11-12 |
| 8518742 | Semiconductor packaging with internal wiring bus | Chenglin Liu, Albert Wu | 2013-08-27 |
| 8482112 | Semiconductor package | Chenglin Liu | 2013-07-09 |
| 8471376 | Integrated circuit packaging configurations | Albert Wu | 2013-06-25 |
| 8372692 | Method of stacking flip-chip on wire-bonded chip | Albert Wu | 2013-02-12 |
| 8357568 | Thermal enhanced package | Chenglin Liu | 2013-01-22 |