Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666510 | Dual row quad flat no-lead semiconductor package | Sheng C. Liao, Shiann-Ming Liou | 2017-05-30 |
| 9614923 | Method and device for controlling peripheral devices via a social networking platform | Xiangyao Lin, Liangliang Fan, Jinhai Liu, Yaobo Hua, Shihai Cheng +8 more | 2017-04-04 |
| 9565263 | Method and device for controlling peripheral devices via a social networking platform | Xiangyao Lin, Liangliang Fan, Jinhai Liu, Yaobo Hua, Shihai Cheng +8 more | 2017-02-07 |
| 9549239 | Earphone wire control device, earphone, voice recording system and voice recording method | Yuejun Liu | 2017-01-17 |
| 9444902 | Method and device for controlling peripheral devices via a social networking platform | Xiangyao Lin, Liangliang Fan, Jinhai Liu, Yaobo Hua, Shihai Cheng +8 more | 2016-09-13 |
| 9425139 | Dual row quad flat no-lead semiconductor package | Sheng C. Liao, Shiann-Ming Liou | 2016-08-23 |
| 9313289 | Method and device for controlling peripheral devices via a social networking platform | Xiangyao Lin, Liangliang Fan, Jinhai Liu, Yaobo Hua, Shihai Cheng +8 more | 2016-04-12 |
| 9299589 | Ball grid array package with laser vias and methods for making the same | Chender Chen, Xiaoting Chang | 2016-03-29 |
| 9288909 | Ball grid array package substrate with through holes and method of forming same | Shiann-Ming Liou | 2016-03-15 |
| 9265077 | Method and device for controlling peripheral devices via a social networking platform | Shihai Cheng, Liangliang Fan, Kai Liu, Xiangyao Lin, Jinhai Liu +5 more | 2016-02-16 |
| 9224677 | Semiconductor package | Shiann-Ming Liou | 2015-12-29 |
| 9179270 | Intercommunication methods and devices based on digital networks | Yuejun Liu, Kai Liu, Liangliang Fan, Yi Dan | 2015-11-03 |
| 9123699 | Formation of package pins in semiconductor packaging | Huahung Kao, Shiann-Ming Liou | 2015-09-01 |
| 9065788 | Method, device and system for voice communication | Bin Zhang, Yuejun Liu, Kai Liu, Jinhai Liu, Liangliang Fan +9 more | 2015-06-23 |
| 9064784 | Ball grid array package with laser vias and methods for making the same | Chender Chen, Xiaoting Chang | 2015-06-23 |
| 8999755 | Etched hybrid die package | Shiann-Ming Liou | 2015-04-07 |
| 8900932 | Thermal enhanced package | Shiann-Ming Liou | 2014-12-02 |
| 8848313 | Thermal solution for drive systems such as hard disk drives and digital versatile discs | Shiann-Ming Liou | 2014-09-30 |
| 8809118 | Chip on leads | Shiann-Ming Liou | 2014-08-19 |
| 8741694 | Placing heat sink into packaging by strip formation assembly | Chender Chen, Shiann-Ming Liou | 2014-06-03 |
| 8673687 | Etched hybrid die package | Shiann-Ming Liou | 2014-03-18 |
| 8581374 | Placing heat sink into packaging by strip formation assembly | Chender Chen, Shiann-Ming Liou | 2013-11-12 |
| 8518742 | Semiconductor packaging with internal wiring bus | Shiann-Ming Liou, Albert Wu | 2013-08-27 |
| 8482112 | Semiconductor package | Shiann-Ming Liou | 2013-07-09 |
| 8357568 | Thermal enhanced package | Shiann-Ming Liou | 2013-01-22 |