Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4811082 | High performance integrated circuit packaging structure | Perwaiz Nihal, Burhan Ozmat, Henri D. Schnurmann | 1989-03-07 |
| 4782008 | Plasma-resistant polymeric material, preparation thereof, and use thereof | Edward D. Babich, Michael Hatzakis, Juri R. Parasczcak, Jane M. Shaw, David F. Witman | 1988-11-01 |