| 6476470 |
Integrated circuit packaging |
Robert K. Peterson |
2002-11-05 |
| 6397450 |
Method of cooling an electronic power module using a high performance heat exchanger incorporating metal foam therein |
— |
2002-06-04 |
| 6377461 |
Power electronic module packaging |
Mustansir Kheraluwala, Eladio Clemente Delgado, Charles Steven Korman, Paul Alan McConnelee |
2002-04-23 |
| 6232151 |
Power electronic module packaging |
Mustansir Kheraluwala, Eladio Clemente Delgado, Charles Steven Korman, Paul Alan McConnelee |
2001-05-15 |
| 6196307 |
High performance heat exchanger and method |
— |
2001-03-06 |
| 5756368 |
Integrated circuit packaging method and the package |
Robert K. Peterson |
1998-05-26 |
| 5754403 |
Constraining core for surface mount technology |
Robert K. Peterson, Aubrey I. Chapman |
1998-05-19 |
| 5402004 |
Heat transfer module for ultra high density and silicon on silicon packaging applications |
— |
1995-03-28 |
| 5195021 |
Constraining core for surface mount technology |
Robert Gordon |
1993-03-16 |
| 4943468 |
Ceramic based substrate for electronic circuit system modules |
Robert Gordon, Brian Love, Robert K. Peterson |
1990-07-24 |
| 4866507 |
Module for packaging semiconductor integrated circuit chips on a base substrate |
Scott Jacobs, Perwaiz Nihal, Henri D. Schnurmann, Arthur R. Zingher |
1989-09-12 |
| 4817093 |
Method of partitioning, testing and diagnosing a VLSI multichip package and associated structure |
Scott Jacobs, Maurice T. McMahon, Perwaiz Nihal, Henri D. Schnurmann, Arthur R. Zingher |
1989-03-28 |
| 4811082 |
High performance integrated circuit packaging structure |
Scott Jacobs, Perwaiz Nihal, Henri D. Schnurmann |
1989-03-07 |
