Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8899459 | Breaking apparatus and breaking method for substrate made of brittle material | Noriyuki Kondo | 2014-12-02 |
| 8536024 | Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus | Shohei Nagatomo, Mitsuru SUGATA | 2013-09-17 |
| 5568252 | Method and apparatus for measuring insulation film thickness of semiconductor wafer | Tatsufumi Kusuda, Motohiro Kouno, Sadao Hirae | 1996-10-22 |
| 5239183 | Optical gap measuring device using frustrated internal reflection | Motohiro Kouno, Takamasa Sakai, Sadao Hirae | 1993-08-24 |
| 5233291 | Method of and apparatus for measuring electric characteristics of semiconductor wafer | Motohiro Kouno, Takamasa Sakai | 1993-08-03 |
| 5225690 | Gap measuring device and method using frustrated internal reflection | Takamasa Sakai, Motohiro Kouno, Sadao Hirae | 1993-07-06 |
| 4803948 | Heat processing apparatus for semiconductor manufacturing | Keiji Nakagawa, Takamasa Sakai, Yusuke Muraoka | 1989-02-14 |