Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10558576 | Storage device with rapid overlay access | Raghavendra Gopalakrishnan | 2020-02-11 |
| 9959148 | Method and device for estimating optimal resources for server virtualization | Suresh Kakkar, Vasudha Mishra | 2018-05-01 |
| 7096447 | Method and apparatus for efficiently locating and automatically correcting certain violations in a complex existing circuit layout | Mu-Jing Li, Suryanarayana R. Maturi | 2006-08-22 |
| 6608335 | Grounded fill in a large scale integrated circuit | Timothy Horel, Mu-Jing Li, Ward Vercruysse | 2003-08-19 |
| 6499135 | Computer aided design flow to locate grounded fill in a large scale integrated circuit | Mu-Jing Li, Ward Vercruysse, Timothy Horel | 2002-12-24 |
| 5670419 | Method of fabricating antifuses in an integrated circuit device and resulting structure | William P. Ingram, III, Monta R. Holzworth, Richard K. Klein | 1997-09-23 |
| 5527745 | Method of fabricating antifuses in an integrated circuit device and resulting structure | William P. Ingram, III, Monta R. Holzworth, Richard K. Klein | 1996-06-18 |
| 5493147 | Antifuse circuit structure for use in a field programmable gate array and method of manufacture thereof | Monta R. Holzworth, Richard K. Klein, William P. Ingram, III | 1996-02-20 |
| 5384481 | Antifuse circuit structure for use in a field programmable gate array and method of manufacture thereof | Monta R. Holzworth, Richard K. Klein, William P. Ingram, III | 1995-01-24 |
| 5329153 | Antifuse with nonstoichiometric tin layer and method of manufacture thereof | — | 1994-07-12 |
| 5322812 | Improved method of fabricating antifuses in an integrated circuit device and resulting structure | William P. Ingram, III, Monta R. Holzworth, Richard K. Klein | 1994-06-21 |
| 5233217 | Plug contact with antifuse | Monta R. Holzworth, Richard K. Klein, William P. Ingram, III | 1993-08-03 |
| 5192715 | Process for avoiding spin-on-glass cracking in high aspect ratio cavities | John W. Sliwa | 1993-03-09 |
| 5119164 | Avoiding spin-on-glass cracking in high aspect ratio cavities | John W. Sliwa | 1992-06-02 |
| 4962060 | Making a high speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism | Jack Sliwa, Mohammad Farnaam, Lewis Shen | 1990-10-09 |
| 4960732 | Contact plug and interconnect employing a barrier lining and a backfilled conductor material | Jack Sliwa, Richard K. Klein, Craig S. Sander, Mohammad Farnaam | 1990-10-02 |
| 4884123 | Contact plug and interconnect employing a barrier lining and a backfilled conductor material | Jack Sliwa, Richard K. Klein, Craig S. Sander, Mohammad Farnaam | 1989-11-28 |
| 4847674 | High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism | Jack Sliwa, Mohammad Farnaam, Lewis Shen | 1989-07-11 |