| 4962060 |
Making a high speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism |
Jack Sliwa, Pankaj Dixit, Lewis Shen |
1990-10-09 |
| 4960732 |
Contact plug and interconnect employing a barrier lining and a backfilled conductor material |
Pankaj Dixit, Jack Sliwa, Richard K. Klein, Craig S. Sander |
1990-10-02 |
| 4884123 |
Contact plug and interconnect employing a barrier lining and a backfilled conductor material |
Pankaj Dixit, Jack Sliwa, Richard K. Klein, Craig S. Sander |
1989-11-28 |
| 4847674 |
High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism |
Jack Sliwa, Pankaj Dixit, Lewis Shen |
1989-07-11 |
| 4820611 |
Titanium nitride as an antireflection coating on highly reflective layers for photolithography |
William H. Arnold, Jack Sliwa |
1989-04-11 |
| 4774416 |
Large cross-sectional area molecular beam source for semiconductor processing |
Farid Askary, Mehdi Balooch |
1988-09-27 |