Issued Patents All Time
Showing 26–50 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115860 | High voltage monolithic LED chip | Kevin Haberern, Matthew Donofrio, Bennett Langsdorf, Thomas Place | 2018-10-30 |
| 10109773 | Light-emitting devices having closely-spaced broad-spectrum and narrow-spectrum luminescent materials and related methods | Iliya Todorov, David Clatterbuck, Jasper Cabalu, Brian T. Collins, Florin A. Tudorica | 2018-10-23 |
| 10074635 | Solid state light emitter devices and methods | Nishant Tiwari, Colin Blakely, Jesse Colin Reiherzer, Mark Edmond, Arthur Fong-Yuen Pun | 2018-09-11 |
| 10008484 | Solid state light fixtures suitable for high temperature operation having separate blue-shifted-yellow/green and blue-shifted-red emitters | Florin A. Tudorica, P. Joseph DeSena, Jr. | 2018-06-26 |
| 9909723 | Small form-factor LED lamp with color-controlled dimming | Julio A. Garceran | 2018-03-06 |
| 9905731 | High output group III nitride light emitting diodes | John Edmond, David T. Emerson, Kevin Haberern | 2018-02-27 |
| 9887327 | LED package with encapsulant having curved and planar surfaces | Jesse Colin Reiherzer, Andrew Signor, Joseph G. Clark | 2018-02-06 |
| 9871173 | Light emitting devices having closely-spaced broad-spectrum and narrow-spectrum luminescent materials and related methods | Iliya Todorov, David Clatterbuck, Jasper Cabalu, Brian T. Collins, Florin A. Tudorica | 2018-01-16 |
| RE46589 | Group III nitride LED with undoped cladding layer and multiple quantum well | John Edmond, Kathleen Marie Doverspike, Hua-Shuang Kong, David T. Emerson | 2017-10-24 |
| RE46588 | Group III nitride LED with undoped cladding layer | John Edmond, Kathleen Marie Doverspike, Hua-Shuang Kong | 2017-10-24 |
| 9786639 | Solid state light fixtures suitable for high temperature operation having separate blue-shifted-yellow/green and blue-shifted-red emitters | Florin A. Tudorica, P. Joseph DeSena, Jr. | 2017-10-10 |
| 9759389 | LED based candelabra lamp | David Power, Scott D. Schwab, Francis Wong Daw Heng, Weng Cheng-Yao, Chen Guang-Yi | 2017-09-12 |
| 9728676 | High voltage monolithic LED chip | Kevin Haberern, Matthew Donofrio, Bennett Langsdorf, Thomas Place | 2017-08-08 |
| D790486 | LED package with truncated encapsulant | Jesse Colin Reiherzer, Jeremy Nevins, Joseph G. Clark | 2017-06-27 |
| D788330 | LED lamp | Jeremy Johnson, David Power, Bart P. Reier | 2017-05-30 |
| 9666764 | Wafer level packaging of multiple light emitting diodes (LEDs) on a single carrier die | Kevin Haberern, Alan Wellford Dillon | 2017-05-30 |
| 9653643 | Wafer level packaging of light emitting diodes (LEDs) | David T. Emerson, Joseph G. Clark, Christopher P. Hussell | 2017-05-16 |
| 9640737 | Horizontal light emitting diodes including phosphor particles | Matthew Donofrio, John Edmond, James Ibbetson, David T. Emerson, Kevin Haberern +2 more | 2017-05-02 |
| 9637822 | Multi-rotation epitaxial growth apparatus and reactors incorporating same | David T. Emerson, David D. Seibel | 2017-05-02 |
| D783547 | LED package | Jesse Colin Reiherzer, Joseph G. Clark, Benjamin A. Jacobson, Sung Chul Joo | 2017-04-11 |
| 9601673 | Light emitting diode (LED) components including LED dies that are directly attached to lead frames | Colin Blakely, Arthur Fong-Yuen Pun, Jesse Colin Reiherzer | 2017-03-21 |
| D777122 | LED package | Jesse Colin Reiherzer, Joseph G. Clark, Benjamin A. Jacobson, Sung Chul Joo | 2017-01-24 |
| 9496458 | Semiconductor light emitting diodes with crack-tolerant barrier structures and methods of fabricating the same | Matthew Donofrio, Kevin Haberern, Kevin Shawne Schneider | 2016-11-15 |
| 9484499 | Transparent ohmic contacts on light emitting diodes with carrier substrates | John Edmond, David B. Slater, Jr. | 2016-11-01 |
| D768889 | LED lamp | David Power, Scott D. Schwab, Francis Wong Daw Heng, Weng Cheng-Yao, Chen Guang-Yi | 2016-10-11 |