Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7332422 | Method for CuO reduction by using two step nitrogen oxygen and reducing plasma treatment | Wei Lu, Liang-Choo Hsia | 2008-02-19 |
| 6513374 | Apparatus to quantify the adhesion of film | Siew Lok Toh, Simon Chooi, Tong Earn Tay | 2003-02-04 |