Issued Patents All Time
Showing 51–75 of 144 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941230 | Electrical connecting structure between a substrate and a semiconductor chip | Keishi Okamoto, Yasumitsu Orii, Kazushige Toriyama | 2018-04-10 |
| 9919526 | Method for manufacturing liquid discharge head | Kazuhiro Asai, Kenji Fujii, Koji Sasaki, Kunihito Uohashi, Jun Yamamuro +3 more | 2018-03-20 |
| 9893031 | Chip mounting structure | Akihiro Horibe, Keishi Okamoto, Kazushige Toriyama | 2018-02-13 |
| 9889669 | Liquid ejecting apparatus and cleaning device | Shigenori Nakagawa | 2018-02-13 |
| 9873255 | Liquid ejection head and method of manufacturing the same | Koji Sasaki, Kenji Fujii, Jun Yamamuro, Kazuhiro Asai, Seiichiro Yaginuma +5 more | 2018-01-23 |
| 9809027 | Method of manufacturing structure and method of manufacturing liquid ejection head | Jun Yamamuro, Kazuhiro Asai, Kunihito Uohashi, Seiichiro Yaginuma, Masahisa Watanabe +3 more | 2017-11-07 |
| 9789690 | Method for manufacturing liquid ejection head | Masahisa Watanabe, Jun Yamamuro, Kazuhiro Asai, Koji Sasaki, Kunihito Uohashi +6 more | 2017-10-17 |
| 9728433 | Attitude changing apparatus, aligning apparatus, attitude changing method and aligning method | Masatoshi Harada, Atsushi Kudo | 2017-08-08 |
| 9697914 | Nuclear power plant and passive containment cooling system | Takashi Sato | 2017-07-04 |
| 9698089 | Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section | Thomas J. Brunschwiler, Dominic Gschwend, Stefano S. Oggioni, Gerd Schlottig, Timo J. Tick +1 more | 2017-07-04 |
| 9669630 | Method for manufacturing liquid ejection head | Seiichiro Yaginuma, Koji Sasaki | 2017-06-06 |
| 9672323 | Reduction of warpage of multilayered substrate or package | Sayuri Hada | 2017-06-06 |
| 9643426 | Liquid ejecting apparatus | Masahiko Sato, Shigenori Nakagawa, Toshinobu Yamazaki | 2017-05-09 |
| 9630413 | Liquid recovery containers and liquid ejection apparatus | Shuhei Harada, Manabu Yamada | 2017-04-25 |
| 9610767 | Liquid ejecting apparatus | Shigenori Nakagawa, Masahiko Sato, Toshinobu Yamazaki, Toshiyuki Suzuki, Takeshi Yoshida | 2017-04-04 |
| 9573387 | Printing apparatus and printing method | Tomoki Shinoda, Kazuyuki Fujioka | 2017-02-21 |
| 9568405 | Method, apparatus, and structure for determining interposer thickness | Sayuri Hada, Akihiro Horibe | 2017-02-14 |
| 9558311 | Surface region selection for heat sink placement | — | 2017-01-31 |
| 9527301 | Liquid ejecting apparatus | Shigenori Nakagawa, Toshinobu Yamazaki, Masahiko Sato, Makoto Otsuki | 2016-12-27 |
| 9472639 | Forming a liquid ejection head with through holes and a depression | Hiroyuki Shimoyama, Taichi Yonemoto, Shuji Koyama, Masaki Ohsumi, Seiichiro Yaginuma | 2016-10-18 |
| 9433077 | Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section | Thomas J. Brunschwiler, Dominic Gschwend, Stefano S. Oggioni, Gerd Schlottig, Timo J. Tick +1 more | 2016-08-30 |
| 9421773 | Process for producing liquid ejection head | Kazuhiro Asai, Kunihito Uohashi, Shuji Koyama | 2016-08-23 |
| 9409398 | Maintenance unit and liquid ejecting apparatus | Shigenori Nakagawa, Toshinobu Yamazaki, Masahiko Sato | 2016-08-09 |
| 9393791 | Liquid ejecting apparatus | Hitotoshi Kimura, Takayuki Kawakami | 2016-07-19 |
| 9384314 | Reduction of warpage of multilayered substrate or package | Sayuri Hada | 2016-07-05 |