Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9553135 | Flexible display substrate and method for manufacturing the same | Chunyan Xie, Lu Liu | 2017-01-24 |
| 9462394 | Splicing type electret loudspeaker | Mou-Ong Sher, Ryan Hsin-Chin Jiang | 2016-10-04 |
| 9406902 | Flexible display panel having folding areas and non-folding areas | Shih-Hsing Hung, Chih-Jen Hu | 2016-08-02 |
| 9349700 | Semiconductor device and method of forming stress-reduced conductive joint structures | CHIEN-CHEN LEE | 2016-05-24 |
| 9245834 | Semiconductor device and method of forming compliant conductive interconnect structure in flipchip package | — | 2016-01-26 |
| 9118986 | Flat speaker output device and method for starting the same | — | 2015-08-25 |
| 8690550 | Membrane micropump | An-Bang Wang, I-Chun Lin, Wen-Huei Tsai | 2014-04-08 |
| 8673658 | Fabricating method of semiconductor device | John Hon-Shing Lau, Ra-Min Tain | 2014-03-18 |
| 8629966 | Display panel and sealing structure | Chih-Wei Chu, Shih-Yu Wang | 2014-01-14 |
| 8570272 | Electrophoresis display panel | Chih-Wei Chu, Shih-Yu Wang | 2013-10-29 |
| 8502224 | Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor | Ra-Min Tain, John Hon-Shing Lau, Wei Li, Ming-Ji Dai | 2013-08-06 |
| 8503065 | Electrophoretic display structure | Shih-Hsing Hung | 2013-08-06 |
| 8456017 | Filled through-silicon via with conductive composite material | Ming-Ji Dai, Heng-Chieh Chien, Jui-Feng Hung, Ra-Min Tain, John Hon-Shing Lau | 2013-06-04 |
| 8437073 | Electrophoretic display device | Shih-Hsing Hung, Chih-Jen Hu | 2013-05-07 |
| 8397584 | Fabricating method and testing method of semiconductor device and mechanical integrity testing apparatus | John Hon-Shing Lau, Ra-Min Tain | 2013-03-19 |
| 8279515 | Electrophoretic display | Shih-Hsing Hung, Chih-Jen Hu | 2012-10-02 |
| 8193625 | Stacked-chip packaging structure and fabrication method thereof | Chun-Kai Liu, Chih-Kuang Yu, Ming-Ji Dai | 2012-06-05 |
| 8188360 | Thermoelectric conversion device | Suh-Yun Feng, Chun-Kai Liu, Chih-Kuang Yu | 2012-05-29 |
| 8149498 | Package structure of a flexible display device | Shih-Hsing Hung, Chih-Jen Hu | 2012-04-03 |
| 8102058 | Chip package structure and method for fabricating the same | Ra-Min Tain, Wei Li | 2012-01-24 |
| 8089603 | Fabrication method of liquid crystal display panel | Chih-Wei Chu, Shih-Yu Wang | 2012-01-03 |
| 8035791 | Display panel and electro-optical apparatus | Chih-Wei Chu, Chung-Wei Liu, Shih-Yu Wang | 2011-10-11 |
| 8004079 | Chip package structure and manufacturing method thereof | Ra-Min Tain, Yu-Lin Chao, Shu-Jung Yang, Rong-Chang Fang, Wei Li +1 more | 2011-08-23 |
| 7973904 | Liquid crystal display panel | Chih-Wei Chu, Shih-Yu Wang | 2011-07-05 |
| 7843517 | Touch panel having sensing spacers | Shih-Yu Wang, Chih-Wei Chu | 2010-11-30 |