Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12428520 | Epoxy resin composition | Miran Yu, Guenter Scherr, Dieter Mayer, Madhura Shreekar Pawar | 2025-09-30 |
| 12134834 | Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent | Alexander FLUEGEL, Charlotte Emnet, Nadine ENGELHARDT | 2024-11-05 |
| 12098473 | Composition for cobalt plating comprising additive for void-free submicron feature filling | Sathana Kitayaporn, Charlotte Emnet, Dieter Mayer, Nadine ENGELHARDT, Lucas Benjamin HENDERSON +1 more | 2024-09-24 |
| 12054842 | Composition for tin-silver alloy electroplating comprising a complexing agent | Katharina Fritzsche, Doris KREMZOW-GRAW, Alexander FLUEGEL | 2024-08-06 |
| 11926918 | Composition for metal plating comprising suppressing agent for void free filing | Marcel Patrik KIENLE, Dieter Mayer, Alexandra Haag, Charlotte Emnet, Alexander FLUEGEL | 2024-03-12 |
| 11840771 | Composition for tin or tin alloy electroplating comprising suppressing agent | Alexander FLUEGEL, Nadine ENGELHARDT, Marcel Patrik KIENLE | 2023-12-12 |
| 11585004 | Composition for cobalt or cobalt alloy electroplating | Chiao Wei, Tzu-Tsang Huang, Shih-Ming Lin, Cheng-Chen Kuo, Shih-Wei Chou +1 more | 2023-02-21 |
| 11535946 | Composition for tin or tin alloy electroplating comprising leveling agent | Alexander FLUEGEL, Jean-Pierre Berkan Lindner | 2022-12-27 |
| 11486049 | Composition for metal electroplating comprising leveling agent | Cornelia Roeger-Goepfert, Roman Benedikt Raether, Harald Hoerhammer, Charlotte Emnet, Dieter Mayer | 2022-11-01 |
| 11459665 | Composition for tin or tin alloy electroplating comprising suppressing agent | Alexander FLUEGEL, Marcel Patrik KIENLE, Nadine ENGELHARDT | 2022-10-04 |
| 11387108 | Composition for metal electroplating comprising leveling agent | Marcel Patrik KIENLE, Cornelia Roeger-Goepfert, Dieter Mayer, Alexander FLUEGEL, Charlotte Emnet | 2022-07-12 |
| 11377748 | Composition for cobalt electroplating comprising leveling agent | Nadine ENGELHARDT, Dieter Mayer, Alexander FLUEGEL, Charlotte Emnet, Lucas Benjamin HENDERSON | 2022-07-05 |
| 11242606 | Composition for tin or tin alloy electroplating comprising suppressing agent | Alexander FLUEGEL, Nadine ENGELHARDT, Marcel Patrik KIENLE | 2022-02-08 |
| 9834677 | Composition for metal electroplating comprising leveling agent | Cornelia Roeger-Goepfert, Roman Benedikt Raether, Charlotte Emnet, Dieter Mayer | 2017-12-05 |
| 9758885 | Composition for metal electroplating comprising leveling agent | Marcel Patrik KIENLE, Dieter Mayer, Cornelia Roeger-Goepfert, Alexandra Haag, Charlotte Emnet +1 more | 2017-09-12 |
| 9683302 | Composition for metal electroplating comprising leveling agent | Michael Siemer, Cornelia Roeger-Goepfert, Nicole Meier, Roman Benedikt Raether, Charlotte Emnet +2 more | 2017-06-20 |
| 9631292 | Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features | Cornelia Roeger-Goepfert, Alexander FLUEGEL, Charlotte Emnet, Roman Benedikt Raether, Dieter Mayer | 2017-04-25 |
| 9598540 | Composition for metal electroplating comprising leveling agent | Cornelia Roeger-Goepfert, Roman Benedikt Raether, Dieter Mayer, Charlotte Emnet | 2017-03-21 |
| 8257798 | Method for the creation of extensive variations in size or distance in nanostructure patterns on surfaces | Joachim P. Spatz, Theobald Lohmueller | 2012-09-04 |