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Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent |
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Composition for cobalt plating comprising additive for void-free submicron feature filling |
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| 12054842 |
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| 11926918 |
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| 11840771 |
Composition for tin or tin alloy electroplating comprising suppressing agent |
Marco Arnold, Nadine ENGELHARDT, Marcel Patrik KIENLE |
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| 11535946 |
Composition for tin or tin alloy electroplating comprising leveling agent |
Jean-Pierre Berkan Lindner, Marco Arnold |
2022-12-27 |
| 11459665 |
Composition for tin or tin alloy electroplating comprising suppressing agent |
Marco Arnold, Marcel Patrik KIENLE, Nadine ENGELHARDT |
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| 11387108 |
Composition for metal electroplating comprising leveling agent |
Marcel Patrik KIENLE, Cornelia Roeger-Goepfert, Dieter Mayer, Marco Arnold, Charlotte Emnet |
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| 11377748 |
Composition for cobalt electroplating comprising leveling agent |
Nadine ENGELHARDT, Dieter Mayer, Marco Arnold, Charlotte Emnet, Lucas Benjamin HENDERSON |
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| 11242606 |
Composition for tin or tin alloy electroplating comprising suppressing agent |
Marco Arnold, Nadine ENGELHARDT, Marcel Patrik KIENLE |
2022-02-08 |
| 9758885 |
Composition for metal electroplating comprising leveling agent |
Marcel Patrik KIENLE, Dieter Mayer, Cornelia Roeger-Goepfert, Alexandra Haag, Charlotte Emnet +1 more |
2017-09-12 |
| 9683302 |
Composition for metal electroplating comprising leveling agent |
Michael Siemer, Cornelia Roeger-Goepfert, Nicole Meier, Roman Benedikt Raether, Marco Arnold +2 more |
2017-06-20 |
| 9631292 |
Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features |
Cornelia Roeger-Goepfert, Marco Arnold, Charlotte Emnet, Roman Benedikt Raether, Dieter Mayer |
2017-04-25 |
