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Composition for metal plating comprising suppressing agent for void free filing |
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Composition for metal plating comprising suppressing agent for void free submicron feature filling |
Cornelia Roeger-Goepfert, Roman Benedikt Raether, Dieter Mayer, Charlotte Emnet |
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Composition for metal electroplating comprising leveling agent |
Marcel Patrik KIENLE, Dieter Mayer, Cornelia Roeger-Goepfert, Charlotte Emnet, Alexander FLUEGEL +1 more |
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| 9617647 |
Composition for metal plating comprising suppressing agent for void free submicron feature filling |
Cornelia Roeger-Goepfert, Roman Benedikt Raether, Dieter Mayer, Charlotte Emnet |
2017-04-11 |
| 9011666 |
Composition for metal electroplating comprising leveling agent |
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2015-04-21 |
