Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12127338 | Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus | Mikael Tuominen, Nick Xin | 2024-10-22 |
| 12058810 | Semi-flex component carrier with dielectric material having high elongation and low young modulus | Mikael Tuominen, Nick Xin | 2024-08-06 |
| 12048101 | Component carrier with well-defined outline sidewall cut by short laser pulse and/or green laser | Mikael Tuominen | 2024-07-23 |
| 12041730 | Component carrier with low-solvent fiber-free dielectric layer | Mikael Tuominen, Kim Liu | 2024-07-16 |
| 11963310 | Component carrier having component covered with ultra-thin transition layer | Mikael Tuominen, Kim Liu, Artan Baftiri, Henry Guo | 2024-04-16 |
| 11935221 | User interface for judgment concerning quality classification of displayed arrays of component carriers | Amin Nickkholgh | 2024-03-19 |
| 11937369 | Traceability of subsequent layer structure manufacturing of main body for component carriers by means of laterally and vertically displaced information carrying structures | Azmi Ibrahim, Wenping Dai, Chunjie Shen | 2024-03-19 |
| 11778754 | Component carrier with through hole filled with extra plating structure between sidewalls and plated bridge structure | Robin Zhang | 2023-10-03 |
| 11688668 | Component carrier with low shrinkage dielectric material | Mikael Tuominen | 2023-06-27 |
| 11670613 | Arrangement with central carrier and two opposing layer stacks, component carrier and manufacturing method | Mikael Tuominen, Nick Xin | 2023-06-06 |
| 11617259 | Component carrier with embedded component exposed by blind hole | Mikael Tuominen | 2023-03-28 |
| 11589462 | Semi-flexible component carrier with stepped layer structure | Nick Xin, Mikael Tuominen | 2023-02-21 |
| 11483927 | Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric | Ismadi Bin Ismail, Valerian Yun Khim Chung, Alex Yucun Dou | 2022-10-25 |
| 11470714 | Component carrier with embedded component and horizontally elongated via | Gin Feng, Sally Sun, Mikael Tuominen | 2022-10-11 |
| 11452212 | Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially | Mikael Tuominen, Sally Sun | 2022-09-20 |
| 11445601 | Component carrier and method of manufacturing a component carrier | Mikael Tuominen | 2022-09-13 |
| 11330706 | Component carrier with embedded large die | Mikael Tuominen | 2022-05-10 |
| 11291119 | Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus | Mikael Tuominen, Nick Xin | 2022-03-29 |
| 11284508 | Semi-flex component carrier with dielectric material having high elongation and low young modulus | Mikael Tuominen, Nick Xin | 2022-03-22 |
| 11284511 | Component carrier with different surface finishes and method for manufacturing the same | Giordano Di Gregorio, Karl L. Wang | 2022-03-22 |
| 11160165 | Component carrier with through hole extending through multiple dielectric layers | Mikael Tuominen, Sally Sun, Robin Zhang | 2021-10-26 |
| 11083081 | Electronic package comprising a decoupling layer structure | Mikael Tuominen | 2021-08-03 |
| 11039535 | Manufacturing holes in component carrier material | Abderrazzaq Ifis, Haina Wu | 2021-06-15 |
| 10966318 | Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric | Ismadi Bin Ismail, Valerian Yun Khim Chung, Alex Yucun Dou | 2021-03-30 |