Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396091 | Component carrier with a via containing a hardened filling material | ShuYing Yao, Jens Riedler, Vanesa López Blanco | 2025-08-19 |
| 12232263 | Component carriers connected by staggered interconnect elements | Jens Riedler, Christopher D. Hermann | 2025-02-18 |
| 12219701 | Component carrier | Reinhard Opitz | 2025-02-04 |
| 12167529 | Heat removal architecture for stack-type component carrier with embedded component | — | 2024-12-10 |
| 12052824 | Component carriers connected by staggered interconnect elements | Jens Riedler, Christopher D. Hermann | 2024-07-30 |
| 12009315 | Component carrier structure connectable by electrically conductive connection medium in recess with cavity having surface profile | — | 2024-06-11 |
| 11778751 | Compensating misalignment of component carrier feature by modifying target design concerning correlated component carrier feature | Markus Leitgeb | 2023-10-03 |
| 11510316 | Overhang-compensating annular plating layer in through hole of component carrier | — | 2022-11-22 |
| 11081416 | Configuring a sealing structure sealing a component embedded in a component carrier for reducing mechanical stress | Wolfgang Schrittwieser, Christian Vockenberger | 2021-08-03 |
| 11051403 | Overhang-compensating annular plating layer in through hole of component carrier | — | 2021-06-29 |
| 11039535 | Manufacturing holes in component carrier material | Seok Kim Tay, Haina Wu | 2021-06-15 |
| 11013119 | Component carrier with deformed layer for accommodating component | — | 2021-05-18 |
| 10950463 | Manufacturing trapezoidal through-hole in component carrier material | — | 2021-03-16 |