Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396091 | Component carrier with a via containing a hardened filling material | ShuYing Yao, Abderrazzaq Ifis, Vanesa López Blanco | 2025-08-19 |
| 12232263 | Component carriers connected by staggered interconnect elements | Abderrazzaq Ifis, Christopher D. Hermann | 2025-02-18 |
| 12052824 | Component carriers connected by staggered interconnect elements | Abderrazzaq Ifis, Christopher D. Hermann | 2024-07-30 |