Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396091 | Component carrier with a via containing a hardened filling material | Abderrazzaq Ifis, Jens Riedler, Vanesa López Blanco | 2025-08-19 |
| 9648758 | Method for producing a circuit board and use of such a method | Siegfried Götzinger, Mikael Tuominen, Beck Han | 2017-05-09 |