Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12127338 | Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus | Nick Xin, Seok Kim Tay | 2024-10-22 |
| 12058810 | Semi-flex component carrier with dielectric material having high elongation and low young modulus | Nick Xin, Seok Kim Tay | 2024-08-06 |
| 12048101 | Component carrier with well-defined outline sidewall cut by short laser pulse and/or green laser | Seok Kim Tay | 2024-07-23 |
| 12041730 | Component carrier with low-solvent fiber-free dielectric layer | Seok Kim Tay, Kim Liu | 2024-07-16 |
| 11963310 | Component carrier having component covered with ultra-thin transition layer | Seok Kim Tay, Kim Liu, Artan Baftiri, Henry Guo | 2024-04-16 |
| 11700690 | Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule | — | 2023-07-11 |
| 11688668 | Component carrier with low shrinkage dielectric material | Seok Kim Tay | 2023-06-27 |
| 11672079 | Component carrier with improved bending performance | Nick Xin | 2023-06-06 |
| 11670613 | Arrangement with central carrier and two opposing layer stacks, component carrier and manufacturing method | Nick Xin, Seok Kim Tay | 2023-06-06 |
| 11617259 | Component carrier with embedded component exposed by blind hole | Seok Kim Tay | 2023-03-28 |
| 11605569 | Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuit | Christian Vockenberger | 2023-03-14 |
| 11589462 | Semi-flexible component carrier with stepped layer structure | Nick Xin, Seok Kim Tay | 2023-02-21 |
| 11546990 | Component carrier with bridge structure in through hole fulfilling minimum distance design rule | — | 2023-01-03 |
| 11470714 | Component carrier with embedded component and horizontally elongated via | Gin Feng, Sally Sun, Seok Kim Tay | 2022-10-11 |
| 11452212 | Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially | Seok Kim Tay, Sally Sun | 2022-09-20 |
| 11445601 | Component carrier and method of manufacturing a component carrier | Seok Kim Tay | 2022-09-13 |
| 11410965 | Electronic device with embedded component carrier | — | 2022-08-09 |
| 11343916 | Component carrier and method of manufacturing the same | — | 2022-05-24 |
| 11330706 | Component carrier with embedded large die | Seok Kim Tay | 2022-05-10 |
| 11291119 | Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus | Nick Xin, Seok Kim Tay | 2022-03-29 |
| 11284508 | Semi-flex component carrier with dielectric material having high elongation and low young modulus | Nick Xin, Seok Kim Tay | 2022-03-22 |
| 11219120 | Stress relief opening for reducing warpage of component carriers | Artan Baftiri, Nick Xin | 2022-01-04 |
| 11219129 | Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule | — | 2022-01-04 |
| 11211317 | Component carrier comprising a component having vertical through connection | — | 2021-12-28 |
| 11160165 | Component carrier with through hole extending through multiple dielectric layers | Seok Kim Tay, Sally Sun, Robin Zhang | 2021-10-26 |