Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322622 | Component carrier with gap around component core and filled with first material in bottom portion and with second material in top portion | — | 2025-06-03 |
| 12136580 | Embedding methods for fine-pitch components and corresponding component carriers | Jeesoo Mok | 2024-11-05 |
| 12041721 | Component carrier comprising at least two components | Dominik Wilding | 2024-07-16 |
| 11963310 | Component carrier having component covered with ultra-thin transition layer | Mikael Tuominen, Seok Kim Tay, Kim Liu, Henry Guo | 2024-04-16 |
| 11622443 | Component carrier and method of manufacturing the same | — | 2023-04-04 |
| 11570905 | Method of manufacturing component carrier and component carrier | — | 2023-01-31 |
| 11219120 | Stress relief opening for reducing warpage of component carriers | Mikael Tuominen, Nick Xin | 2022-01-04 |
| 11127670 | Component carrier with stabilizing structure for interface adhesion | — | 2021-09-21 |
| 11051391 | Thermally highly conductive coating on base structure accommodating a component | Mikael Tuominen, Annie Tay | 2021-06-29 |
| 10939548 | Component carrier with improved toughness factor | Mikael Tuominen | 2021-03-02 |
| 10653009 | Component carrier with improved toughness factor | Mikael Tuominen | 2020-05-12 |