Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11116083 | Electronic component embedded by laminate sheet | Mikael Tuominen | 2021-09-07 |
| 11051391 | Thermally highly conductive coating on base structure accommodating a component | Mikael Tuominen, Artan Baftiri | 2021-06-29 |
| 11051410 | Component carriers sandwiching a sacrificial structure and having pure dielectric layers next to the sacrificial structure | Nikolaus Bauer-Oeppinger, Giordano DiGregorio, Philips Dai | 2021-06-29 |
| 10973133 | Sacrificial structure with dummy core and two sections of separate material thereon for manufacturing component carriers | Nikolaus Bauer-Oeppinger, Giordano DiGregorio, Philips Dai | 2021-04-06 |
| 10779415 | Component embedding in thinner core using dielectric sheet | Mikael Tuominen | 2020-09-15 |
| 10455704 | Method for copper filling of a hole in a component carrier | Ares Wang, Yee-Bing Ling | 2019-10-22 |