Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11470714 | Component carrier with embedded component and horizontally elongated via | Gin Feng, Seok Kim Tay, Mikael Tuominen | 2022-10-11 |
| 11452212 | Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially | Mikael Tuominen, Seok Kim Tay | 2022-09-20 |
| 11160165 | Component carrier with through hole extending through multiple dielectric layers | Mikael Tuominen, Seok Kim Tay, Robin Zhang | 2021-10-26 |
| 10433415 | Component carrier comprising a copper filled mechanical drilled multiple-diameter bore | Yee-Bing Ling, Nikolaus Bauer-Öppinger, Wilhelm Tamm | 2019-10-01 |